1.8+ years working experience in Back grind and wafer backside metal process 8年以上金屬背面研磨和晶圓加工工作經(jīng)驗(yàn) 2. Be familiar with DISCO DFG8540, DGP8761 machine, taiko technology, wafer backside metal, etch and IPA dry process. 熟悉DISCO DFG8540， DGP8761機(jī)器，taiko技術(shù)，晶圓背面金屬，蝕刻，IPA干燥工藝 3. Good presentation and communication skills in Chinese and English. 良好的中英文表達(dá)和溝通能力 4. Strong problem solving skills and ability to handle process issue independently. 較強(qiáng)的問(wèn)題解決能力和獨(dú)立處理工藝問(wèn)題的能力 5. Good team work player. 良好的團(tuán)隊(duì)合作精神
崗位職責(zé)： 1. Responsible for root cause analysis for abnormal mass production products, continuous yield improvement, deal with finding and customer problems during customer audit. 負(fù)責(zé)量產(chǎn)產(chǎn)品異常的根本原因分析，持續(xù)改善良率，處理客戶審核過(guò)程中發(fā)現(xiàn)的問(wèn)題 2. Generate Spec include FMEA, control plan, SOP, OCAP and checklist. 生成規(guī)范包括FMEA，控制計(jì)劃，SOP， OCAP和檢查表 3. IDM&DM low cost material evaluation. IDM&DM低成本材料評(píng)估 4. Analyze the raw data and improve yield&quality. 分析原始數(shù)據(jù)，提高產(chǎn)量和質(zhì)量。 5. Lead team to optimize Top 5 defect, effective improvement action release to MP. 帶領(lǐng)團(tuán)隊(duì)優(yōu)化前5大缺陷，并將有效的改進(jìn)措施發(fā)布給產(chǎn)品經(jīng)理 6. Coordinate to audit supplier capability. 協(xié)調(diào)審核供應(yīng)商能力。 7. Responsible for the coordination work of the different group. 負(fù)責(zé)各小組的協(xié)調(diào)工作 8. Coordinate to develop new system which can reduce overload work. 協(xié)調(diào)開發(fā)新系統(tǒng)，減少超負(fù)荷工作
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